ROC Optoelectronics precision optical glass manufacturer
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Wafer
Precision‑processed wafers from glass, fused silica and quartz, available in 4–12 inch sizes
  • MATERIAL

    Glass, Fused Silica & Quartz

  • SCHOTT

    BOROFLOAT® 33 / B270 / D263 / BK7 etc.

  • Corning

    Eagle XG, Fused Silica 7980 / 7978 / 7979 etc.

  • Shenguang

    Fused silica JGS1 / JGS2 & single quartz etc.

* The product can be customized
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Parameters
Specification Unit 4" 6" 8" 10" 12"
Diameter mm 100 150 200 250 300
Tolerance (±) mm ±0.05
Thickness mm 0.1–2
TTV μm <2 <3 <3 <3 <3
Bow μm ≤10 ≤20 ≤20 ≤20 ≤20
Warp μm ≤10 ≤30 ≤30 ≤30 ≤30
Surface Quality 20/10
Surface Roughness / Ra nm ≤5
Edge Chamfer 45°, C0.2±0.1 mm
Packaging Cleanroom-sealed packaging / PE protective film / Wafer cassette / Wafer container

Semiconductor Process Support, MEMS & Photonics Applications
Glass, fused silica and quartz wafers are used as precision substrates, carrier wafers, optical windows and filter substrates in semiconductor-related process support, MEMS devices, wafer-level packaging and photonic components.
ROC supports custom wafer processing where flatness, TTV, surface quality, edge quality and cleanliness are critical before coating, bonding, lithography, packaging or optical assembly.

  • Semicon ductor Process Support
  • MEMS
  • Photonic & Optical Devices