Equipment Behind Our Capabilities
ROC’s precision processing capabilities are supported by advanced manufacturing and metrology equipment for cutting, CNC machining, grinding, lapping, polishing, edge finishing and surface inspection. From prototypes to volume production, our equipment platform helps ensure dimensional accuracy, surface quality and consistent batch performance.
White Light Interferometer
White Light Interferometer
Nano-scale 3D Surface Measurement Expert
Measurement Performance
- 0.001 nm vertical resolution
- 0.003 nm repeatability
- 0.06% step height repeatability
Fully Automatic Edge Beveling Machine
Fully Automatic Edge Beveling Machine
Dedicated Equipment for Round Glass Edge Processing
Equipment Features
- Dual-station synchronized processing for improved production efficiency
- Adjustable functions to meet different processing requirements
Suitable for processing
- Round glass wafers
- Optical glass
- Ceramic discs and other brittle materials
High-Precision Double-Sided Lapping & Polishing Machine
High-Precision Double-Sided Lapping & Polishing Machine
High-Precision Double-Sided Lapping & Polishing Machine
32B-5L/P Series — Expert Solution for Hard and Brittle Material Processing
- Heavy-duty machine structure, High rigidity, Excellent stability
- Fully automatic control, Multiple drive options available
Maximum Processing Diameter: 760 mm
Maximum Processing Thickness: 35 mm
Suitable for processing
- Sapphire
- Optical glass
- Ceramic
- Metal
- Quartz and other high-hardness and brittle materials
16B Double-Sided Lapping & Polishing Machine
16B Double-Sided Lapping & Polishing Machine
High-Precision Flat Surface Processing Solution
Integrated lapping and polishing processes
Complete process coverage
Primarily used for
- Silicon wafers
- Sapphire substrates
- Ceramic substrates
- Optical glass
- Quartz wafers and other precision materials
Single-Spindle Precision Engraving Machine (with Tool Magazine)
Single-Spindle Precision Engraving Machine (with Tool Magazine)
High-Precision Granite Base · Intelligent CCD Vision Positioning
Suitable for processing
- Glass panels
- Ceramic covers
- Sapphire lenses
- Acrylic materials and other brittle materials
Fixed-Edge Scanning Polishing Machine
Fixed-Edge Scanning Polishing Machine
Dedicated Equipment for Edge and Arc Scanning Polishing of 2D / 2.5D / 3D Hard and Brittle Materials
Full motion control system, Intelligent human-machine interface
Multi-piece stacked fixture loading, One operator can manage multiple machines
Suitable for processing
- Sapphire
- Optical glass
- Ceramic
- Crystal and other brittle materials
Wafer ID Marking Machine
Wafer ID Marking Machine
Pulsed laser processing, high-speed galvanometer scanning technology,which laser directly interacts with the wafer surface to create required characters, symbols and identification marks
Primarily used for
- ID marking on 8-inch / 12-inch glass wafers
- ID marking on 15-inch square panels
