ROC Optoelectronics precision optical glass manufacturer
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Photomask Blanks

Precision substrates used for semiconductor lithography, supporting wafer exposure and accurate circuit pattern transfer
  • MATERIAL

    Glass, Fused Silica & Quartz

  • SCHOTT

    BOROFLOAT® 33 / B270 / D263 / BK7 etc.

  • Corning

    Eagle XG, Fused Silica 7980 / 7978 / 7979 etc.

  • Shenguang

    Fused silica JGS1 / JGS2 & single quartz etc.

* The product can be customized
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks
Photomask Blanks

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Parameters
Specification Unit Reference spec
Size mm 152 × 152 × 6.35
Tolerance mm OD ±0.2; T ±0.1
Edge Chamfer 90° ±5′; C0.3–0.6 × 45°
Ra nm Front ≤0.4; side ≤5
TTV μm ≤2
Edge quality No pits, chips or edge breakage
Packaging Mask Package Box

Semiconductor Lithography
Used as precision mask blanks for semiconductor lithography, supporting wafer exposure and circuit pattern transfer. ROC supports substrate preparation before coating and patterning, with control of flatness, TTV, edge quality, surface quality and cleanliness.

  • Semiconductor Lithography