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Panel Substrate

310*310 or 515*510 mm glass, fused silica and quartz panel substrates for semiconductor packaging
  • MATERIAL

    Glass, Fused Silica & Quartz

  • SCHOTT

    BOROFLOAT® 33 / B270 / D263 / BK7 etc.

  • Corning

    Eagle XG, Fused Silica 7980 / 7978 / 7979 e tc.

  • Shenguang

    Fused silica JGS1 / JGS2 & single quartz etc

* The product can be customized
Panel Substrate
Panel Substrate
Panel Substrate
Panel Substrate
Panel Substrate
Panel Substrate

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Parameters
Specification unit 310 ×310 mm 515 ×510 mm
Dimensional Tolerance (±) mm ±0.05
Thickness mm 0.5–3
TTV μm ≤3
Warp μm ≤30 ≤200
Surface Quality 20/10
Surface Roughness / Ra nm ≤0.2
Packaging Cleanroom-sealed packaging / PE protective film / PET box

Advanced Semiconductor Packaging
Glass & quartz panel substrates for glass-core packaging and panel-level packaging
applications.
Controlled thickness, low warp, and smooth surfaces support downstream processes such
as temporary bonding, lithography, TGV structuring, and metallization.

  • GLASS-CORE PACKAGING / PANEL-LEVEL PACKAGING